Remedy Your Rework: The 6 Most Common Mistakes Technicians Make

by Kathy S. on June 8, 2015

solderingOne BGA rework blunder could cost you. Choose the wrong solder paste, for example, and you could find yourself in a sticky situation. But don’t worry; you don’t have to throw out the circuit board with the bath water. Many problems like excessive voiding, pad damage and joint bridging can all be avoided. Take a look at the six most common rework mistakes, and head the missteps off at the pass.

  1. Not enough training

Don’t skimp on the training! A sufficiently trained technician can size up any rework situation in advance and will immediately know when things go awry.

  1. Lack of proper equipment

Make sure you’ve got the right tools to get the job done right—the first time. Shop All-Spec’s complete line of soldering and rework equipment, so you can help sustain a controlled, predictable and repeatable process.

  1. Poor profile development

A bad thermal profile can result in damage and reflow of adjacent components. Develop good profiles with correct thermocouple placement and data analysis.

  1. Insufficient prep work

Before you apply the first heat cycle, decide on a solder paste, solder paste stencil, chemistries and alloys. Bake out moisture from the BGA device and board assembly to avoid “popcorning” and other problems.

  1. Reflow of adjacent connections

Technicians need to be constantly aware of how the heat is affecting adjacent components. Reflow of these adjacent connections often creates new rework problems, such as oxidation, de-wetting, starved joints and more.

  1. Inadequate post-placement inspection

Consider X-ray inspection machines. Trained technicians can quickly and easily detect excessive voiding and poor placement or alignment with X-ray inspection.

Be on the lookout for the six most common rework mistakes, and remedy your rework without excessive voiding—not to mention headaches.

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