BGA Conductor Receives a Path Redesign

by Michelle R. on January 29, 2016

From design to production, circuit boards require hours of planning, execution, revision and more revision to arrive at a final product (until the next model comes out). Recently, BGA conductors were evaluated and found to have a design that contained a flaw involving 23 of the 676 balls on their component. The problem? They weren’t connected where they needed to be connected.

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With re-routing as the only viable solution, the design team set about what was a major undertaking. Had the pads that required re-routing been located on the perimeter of the BGA’s layout, the rework would have been much easier. However, their actual location proved to be a challenge that would require meticulous planning.

It was decided that the newly routed pads needed to extend from the center of the component, and they would stretch to the outside of the package footprint so wires could be added to the newly designed pattern of the surface mount pads.

Easy in theory. A bit more challenging in practice.

The initial design placed the new circuits too close to those on the circuit board. Creating a configuration that prevented the newly laid circuit from interfering with the solder paste stenciling and BGA placement required several intricate operations before the new paths were placed where they needed to be.

Whether constructing a new design or improving on a current one, trust your electronic assembly applications to Hisco, where we have the best names in the industry available by phone or on the internet. Call us or visit us online today!

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